TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
Anand Tech
JULY 25, 2023
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. "To meet market needs, TSMC is planning to establish an advanced packaging fab in the Tongluo Science Park," a statement by TSMC reads. "TSMC The company intends to spend around $2.87 Otherwise, the nearly $2.9
Let's personalize your content