SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
Anand Tech
APRIL 5, 2024
The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. billion higher than advanced packaging CapEx budgets of Intel, TSMC and Samsung in 2023, based on estimates from Yole Intelligence. In fact, $3.87
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