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TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging

Anand Tech

billion price tag implies that this will be yet another significant capital expansion project for TSMC – rivaling what would have been the cost of a wafer lithography fab a decade ago. Otherwise, the nearly $2.9

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Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple

Anand Tech

Carrying a price tag of around 2 billion dollars, the plant in Arizona will primarily serve to package chips produced by TSMC at its Fab 21 nearby.

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Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations

Anand Tech

The high price tag of the fab – believed to be the single most expensive advanced packaging facility ever built – underscores just how serious Intel is regarding its advanced packaging technologies and production capacity. The fab near Rio Rancho, New Mexico, cost Intel $3.5 billion to build and equip.

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Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas

Anand Tech

Overall, the final price tag on Samsung's new fab complex is expected to reach $40 billion by the time it's completed later this decade. Samsung plans to equip its fab near Taylor, Texas, with the latest wafer fab tools to produce advanced chips. president, in a statement. "This

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