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AT&T, Ericsson & Intel to Showcase ‘The Power of 5G’ with Batman AR/VR Experience Soon

Road to VR

Mobile World Congress (MWC) is gearing up next week in Barcelona to play host to the latest and greatest in mobile technology, including the presumed Microsoft HoloLens 2. Today AT&T, Ericsson, Intel and Warner Bros. SEE ALSO WiGig Chip Company Peraso Technologies Closes $42M Financing Round. “At Warner Bros.,

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Strider VR is an Intriguing New Omnidirectional Treadmill Solution

Road to VR

Strider VR uses a novel approach to omnidirectional treadmill design, using a rotatable ball array positioned above a traditional linear treadmill, combined with a Microsoft Kinect 2 sensor. One of the main challenges of this type of hardware is the interpretation of virtual movement.

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Meta, IBM Rally XR Community for Global AI Alliance

XR Today - Mixed Reality tag

It will also “foster a vibrant AI hardware accelerator ecosystem” by increasing the number of contributions and adoptions of key software technologies. Meta has also joined the Metaverse Standards Forum , which works on building interoperability, standard file formats and hardware.

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When to Use Virtual Reality (VR) Instead of Augmented Reality (AR)?

InstaVR

Unfortunately, some of the AR hardware companies like Daqri have already shut down. But even the ones that remain and have pretty good traction, such as Microsoft Hololens, have a major shortcoming — immersion. IMMERSION AR is largely limited to mobile phones now, with some AR headsets also in use.

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VR poses challenges for software testing

Hypergrid Business

For example, Microsoft recently announced a deal worth approximately $500 million with the U.S. And as the cost of the hardware continues to drop , headsets could eventually be as integral to gaming consoles in the home as motion sensors were a few years ago. Army to customize development for its HoloLens headset.

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A first look at the Tundra Labs HDK

The Ghost Howls

Some weeks ago, he has bought a Tundra HDK , which is basically a Hardware Development Kit to create your objects that can be tracked by a SteamVR system and has played around with it for a while. Small Package Size simplifies industrial design of tracked objects 3×3 Chip Scale Package, 1.61mm x 1.61mm 9-bump WLCSP, 0.5mm pitch package.

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Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex

Anand Tech

ADATA demonstrated potential candidates to replace SO-DIMMs and RDIMMs/LRDIMMs from client and server machines, respectively, in the coming years, at Computex 2023 in Taipei, Taiwan, reports Tom's Hardware. Image Courtesy Tom's Hardware ADATA displayed a CXL 1.1-compliant S form factor and a PCIe 5.0 x4 interface.

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