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SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond

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APRIL 5, 2024

The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. billion higher than advanced packaging CapEx budgets of Intel, TSMC and Samsung in 2023, based on estimates from Yole Intelligence. In fact, $3.87

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How Transportation Sectors are Leading in Scalable XR Training

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APRIL 11, 2024

million units, and firms like LG and Samsung are also entering the market, with the XR headset space now looking to boom. million units in 2028, translating to a five-year CAGR of 29.2 Many different immersive service providers meet various needs. New IDC data points to shipments in 2024 rising by 44.2 per cent, reaching 9.7

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