SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
Anand Tech
APRIL 5, 2024
The facility will be used to build next-generation types of high-bandwidth memory (HBM) stacks when it begins operations in 2028. Given that the fab comes online in 2028, based on SK hynix's product roadmap we'd expect that it will be used at least in part to assemble HBM4 and HBM4E stacks. In fact, $3.87
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