Micron Qualifies Memory for Snapdragon XR2 Gen 2 Platform
XR Today - Mixed Reality tag
OCTOBER 27, 2023
The Santa Clara-based firm’s solution provides single-chip architectures for immersive VR/MR experiences, enabling headset manufacturers to use thinner, more ergonomic devices without the need for external battery packs. Micron also engineered its UFS 3.1 Micron also engineered its UFS 3.1 With its advanced LPDDR5X and UFS 3.1
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