TSMC: We Want OSATs to Expand Their Advanced Packaging Capability
Anand Tech
OCTOBER 16, 2023
All leading assembly and test specialists like ASE Group, Amkor Technology, and JCET have advanced chip packaging technologies, many resembling those of TSMC. billion advanced packaging facility in Vietnam. In contrast, Samsung spent around $2 billion, according to Yole Group's estimates published by EE Times.
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