Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana
Anand Tech
MARCH 26, 2024
SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. The field of advanced packaging – CoWoS, passive silicon interposers, redistribution layers, die-to-die bonding, and other cutting edge technologies – has seen an explosion in demand in the last half-decade.
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